●Smaller packaging size, thinner and lighter weight (see figure 2)
●Higher intensity
●Improvement of heat dissipation capacity
●Low inductance and resistance
●Higher productivity and low cost
Flip chipis now widely applied in the following fields.
●Embedded Processor
●Application Processor
●Power Management System
●Other products required for low cost and good electric performance
Process Capability for Anst's Flip Chip
●Now, Anst can provide full series of packaging technologies including copper pillar and solder ball type of Flip Chip on lead frame (interconnection of chip and lead frame)
●Process Capability