Structure of Panel Packaging Products

 Panel and Products of SIPLP Microelectronic

 Advantages of SIPLP’s Advanced Packaging Technology

    ●Bumping/Copper Pillar middle process is not needed.

    ●Thick Trace can support bigger current.

    ●Able to realize 6-side protection and the reliability reaches MSL1. Especially suitable for automobile electronics.

    ●Thinner than FC (no substrate or lead frame)

    ●No Bumping, unnecessary Reflow, seamless connection, better product performance and higher reliability.

    ●Smaller parasitic effect

    ●Smaller on-resistance RDSon

    ●Flexible technology. Especially suitable for MCM multiple chips packaging and power module packaging

    ●Able to make Copper Clip PQFN and can realize double cooling.

    ●Especially suitable for embedded passive device of power package, multiple chips package and module package.

    ●EMI shielding Anti-electromagnetic interference

    ●One Panel one Lot

    ●More suitable for the packaging of the third-generation semiconductors such as SiC and GaN.

 SiPLP Packaging Way and Main Application Fields