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 0.11 Ultra-low Leakage
 
 Overview
        CSMC 0.11 ULL process uses aluminum interconnects, 1P8M architecture, offering 1.5V core device and 3.3V I/O device with ultra-low-leakage features, typical Ioff (pA/um) <0.5.
 
 Key Features 
- Single poly, eight-metal-layer process
- Al backend with low-K FSG material
- Device Ioff (typical) <0.5 pA/um
 
 Applications
- MCU
- IOT
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 0.11 ULL flash 
 
 Overview
        CSMC 0.11 ULL flash process technology is embedded flash based on 0.11 ULL, core device is compatible with ULL process, offering ultra-low power analog IP.
 
 Key Features
- Double poly, eight-metal-layer process
- Al backend with low-K FSG material
- Competitive flash macro cell size
 
 Application 
- MCU
- IOT